April 23 Morning Sessions: Radar/Automotive/SATCOM
April 23 Afternoon Sessions: 5G/6G/IoT
October 22 Morning Sessions: SI/PI
October 22 Afternoon Sessions: PCB/Interconnect/EMI Sessions
Radar/Automotive/SATCOM – Morning Sessions, April 23, 2025
9:00 a.m. – 9:30 a.m. Eastern Time
KEYNOTE: Overview of Latest Technical Trends in Radar
Dr. Joe Guerci
The past several years has seen a significant uptick in the introduction of new radar techniques and applications in non-traditional areas. On the technical systems front, advances continue in MIMO methods, cognitive fully adaptive radar (CoFAR), and combined radar and comms or as its come to be known integrated sensing and communications (ISAC). Key advances have also been made in enabling RF and embedded computing technologies including advanced transceivers, radar systems-on-a-chip (RSOC), and all “digital radars”. New and rapidly emerging applications include counter UAS (CUAS) radars, human gesture recognition and health monitoring, and autonomous driving and safety systems. This talk will survey the latest trends with an eye towards the key tech enablers and challenges facing each of these areas.
9:30 a.m. – 10:00 a.m. Eastern Time
Introduction to Advanced Substrate Technologies (Thick Film, Direct Bond Copper, and Active Metal Braze) for Power & RF Needs
Chandra Gupta, PhD
Whether the application is a military and commercial radar, commercial wireless/cellular system, complex IoT network, or a sensor solution deployed in a remote or mobile context — modern RF systems present significant performance, power-handling, form-factor, and operating environment challenges. In many of these applications, metallized ceramics offer significant advantages. To name but three:
• Thick Film substrates/circuits are manufactured using a screen-printing process to deposit multiple layers of conductive, resistive, and dielectric materials onto an insulating substrate, typically alumina, aluminum nitride or beryllium oxide. It is cost-effective, reliable, and compatible with surface-mount technology (SMT).
• Direct Bonded Copper (DBC) consists of alumina or aluminum nitride substrate, with copper film bonded to one or both sides through a high-temperature oxidation process. They are especially well suited for power modules, where efficient heat dissipation and high current carrying capacity are needed.
• Active Metal Braze (AMB) involves brazing a copper foil, to a silicon nitride board using a high-temperature vacuum process. AMB substrates have similar electrical and thermal properties to DBC substrates but are particularly suited for applications requiring high reliability, heat dissipation and high ampacity and excellent heat spreading capabilities.
This presentation will expand on these options, with particular emphasis on thermal management, electrical properties, and mechanical considerations.
10:00 a.m. – 10:30 a.m. Eastern Time
Revolutionizing Mobility: From Connectivity to Insights with Innovative Automotive Technologies
Shane O’Mahony
The automotive industry is undergoing a profound transformation, driven by the advent of software-defined vehicle technologies. These innovations are ushering in an era of hyper-personalized, immersive, and connected vehicle cabins, enhancing safety and efficiency in unprecedented ways. At the heart of this revolution are semiconductor innovations, which play a pivotal role in enabling this mobility transformation. Advanced semiconductor technologies facilitate seamless interoperability between various sub-systems, enhance the vehicle’s ability to sense and interpret the analog world, and provide critical insights that drive actionable outcomes. This presentation will explore how these cutting-edge technologies are revolutionizing mobility, from connectivity and cabin experience to electrification and advanced driver-assistance systems (ADAS), paving the way for a smarter, safer, and more efficient automotive future.
10:30 a.m. – 11:00 a.m. Eastern Time
Demystifying Pulse RADAR Power Measurements – Common Challenges and Solutions
Bob Buxton
Pulse, pulse-doppler, and pulse compression RADARs are widely used in many civilian and military applications. The quality of the transmitted pulses is critical for maximization of many RADAR performance parameters. After an introduction describing RADAR types and applications, this webinar will focus on RADAR pulse characteristics and the challenges that pulse degradations can cause in RADAR performance.
The webinar will conclude with details of RADAR pulse characterization using a powerful, yet cost-effective, solution based on peak power sensors. Important power sensor characteristics will be described along with an actual example of pulse characterization that was critical to the ability to improve RADAR range performance and/or detection capability.
11:00 a.m. – 11:30 a.m. Eastern Time
Transparent Antennas for 5G and Beyond
Daniel T Skiba
This presentation explores the advancements in transparent antenna technology for automotive, 5G and beyond, focusing on CHASM’s innovations using carbon nanomaterials. It highlights the advantages of AgeNT materials, which offer high transparency (>96%) and low sheet resistance (~1 Ω/□), enabling efficient, nearly invisible antennas. The presentation covers material characterization, simulation, and manufacturing optimization, demonstrating performance comparable to traditional antennas.
Applications include automotive, 5G networks, Fixed Wireless Access (FWA), and phased array antennas, which enhance signal directionality and beamforming. With 5G expected to cover 65% of the world by 2025, transparent antennas provide an aesthetically and functionally superior alternative for urban and residential deployments. CHASM’s research underscores its role in driving next-generation connectivity solutions through sustainable, high-performance materials.
5G/6G/IoT – Afternoon Sessions, April 23, 2025
12:00 p.m. – 12:30 p.m. Eastern Time
KEYNOTE: Multiphysics Modeling of High-Speed Communication Devices
Andrew Strikwerda
In this session, we will explore the use of the finite element method (FEM) for multiphysics modeling in high-speed communication technologies, such as phased antenna arrays and 5G millimeter-wave filters. The performance of microwave and millimeter-wave antennas and circuits is pivotal for 5G, the internet of things (IoT), and satellite communications. By employing electromagnetic simulation software to assess these devices before physical fabrication and testing, the design process can be streamlined significantly, saving both time and effort throughout the development cycle.
We will introduce an efficient modeling workflow for microwave and millimeter-wave devices and demonstrate how to incorporate additional physical phenomena such as electromagnetic heating. The session will conclude with a comprehensive overview of the advantages of multiphysics couplings that account for heating, mechanical deformations, and other physical effects.
12:30 p.m. – 1:00 p.m. Eastern Time
The Next Wave of Mobile – Innovations Shaped where AI, Mobile and Cloud Meets
Peter Linder
The most advanced mobile markets have entered the next wave of mobile, five years into the 5G deployment cycle. Characteristic of this inflection point is the transition from Non-Stand-Alone to Stand-Alone 5G architectures, enabling new use cases, networks, business models, and capabilities. This mobile shift is part of the market momentum for AI and Cloud, where 5G connectivity plays a key role in connecting mobile/personal devices.
The new use cases come from application and device innovations delivered over public Mobile 5G infrastructure. With a foundation in high-performing programmable networks, we can also support new sectors that previously depended on wired infrastructure or dedicated networks. Fixed Wireless Access, Wireless WAN, Private 5G Networks, Virtual Private Networks, Mission-Critical and Non-Terrestrial Networks are networks that can support new industry sectors.
This talk will cover the next wave of mobile technology, how AI, Cloud, and Mobile fit together, and the innovations we expect to see on top of the 5G platform. It will also cover the role of differentiated connectivity and the business model innovations required to unlock the potential in the broader ecosystem.
1:00 p.m. – 1:30 p.m. Eastern Time
Optimizing 5G Networks: Coverage, Beamforming, and Performance Enhancement
Shashikumar R
The rapid advancements in wireless connectivity are transforming modern communication, enabling ultra-fast data transfer, low-latency communication, and large-scale IoT integration. As industries adopt 5G and prepare for 6G, innovations in smart cities, autonomous systems, and industrial automation continue to evolve. This webinar explores the latest developments in next-generation networks, their market potential, and future roadmaps, offering key insights into their transformative impact.
A major highlight of the session is Altair WinProp technology (a Feko component), which brings simulation technology for 5G applications using various propagation models and across multiple scenarios. With advanced capabilities in radio coverage prediction, interference analysis, and signal behavior assessment, WinProp enables efficient network planning and deployment, ensuring seamless connectivity in complex environments.
The webinar will cover 5G radio channel and coverage analysis, essential for efficient network design and optimization. In addition, it will explore beamforming techniques, which enhance spectral efficiency, improve signal strength, and maximize network performance. Using advanced modeling and simulation tools, attendees will gain valuable insights into optimizing wireless networks for future advancements.
1:30 p.m. – 2:00 p.m. Eastern Time
5G-Advanced Moving Towards 6G
Viet Nguyen
The transition from 5G to 6G marks a pivotal moment in the evolution of wireless technology, laying the foundation for unprecedented connectivity and innovation. Viet Nguyen, president of 5G Americas will explore how 5G-Advanced serves as a critical bridge towards the 6G era. As an enhancement to the current 5G standard, 5G-Advanced introduces advanced capabilities such as improved spectrum efficiency, AI-driven network optimization, and support for emerging use cases like extended reality (XR), autonomous systems, and digital twins. These developments not only enhance network performance but also address growing demands for sustainability, resilience, and inclusion.
The presentation will delve into the technologies driving this evolution, including advancements in massive MIMO, edge computing, and non-terrestrial networks, while highlighting how these innovations set the stage for the future 6G ecosystem. The collaborative efforts required among industry stakeholders, academia, and governments to shape global standards and ensure seamless integration will also be covered. By providing a forward-looking perspective on the opportunities and challenges of 5G-Advanced, this talk will illuminate how today’s advancements are paving the way for the transformative possibilities of 6G connectivity.
2:00 p.m. – 2:30 p.m. Eastern Time
Simulating and Emulating the Future: 6G RF Propagation Digital Twin
Usman Virk
The rapid advancement of wireless technologies requires innovative design tools capable of accurately simulating complex RF propagation environments. Join Keysight’s Usman Virk and learn how to accelerate the development of advanced 5G and 6G technologies with a comprehensive physical AI testing environment for next-generation wireless systems.
Keysight’s Channel Studio RaySim, RF raytracing Digital Twin Solution, enables fast and precise creation of site-specific RF propagation scenarios for digital twin simulations and real-world device testing through emulation. Combined with Keysight’s base station (BS), user equipment (UE), and channel emulators, the RaySim and integrated digital twin simulations inform network emulation, providing real-world insights into network performance. This approach helps identify network limitations and allows the deployment of 6G technologies to address those challenges effectively.
2:30 p.m. – 3:00 p.m. Eastern Time
5G and 6G IoT Outlook
Joe Madden
A view of how IoT will grow along with AI and automation in various enterprise markets…with details on the requirements for RF component suppliers.
SI/PI – Morning Sessions, October 22, 2025
10:00 a.m. – 10:30 a.m. Eastern Time
Understanding Anisotropic Materials and Tolerances Can Increase Performance at 112/224Gbps and Beyond
Al Neves
The presentation touches on several issues that need to be considered for the AI/112/224/448G space. This includes material Identification for EDA tools, metrics for simulation to measurement that folks are not grooving on but should. It touches on TDR EDA analysis calibration methodology, something that most folks ignore. Another deliverable is how to advance your EDA 3D EM optimization methods using E-field visualization. It is a really good and relevant discussion from folks that live Extreme Signal Integrity.
10:30 a.m. – 11:00 a.m. Eastern Time
How to Use AI to Optimize Your Power Delivery Network
Jared James
Proper use of decoupling capacitors (decaps) can make or break the success of a product. Overdesign with too many decaps contributes unnecessarily to the material costs for the product, while using too few decaps or the wrong decap values will impact the stability of the power delivery network (PDN) and could possibly cause field failures. In addition, simulating the thousands of possible combinations of decap values and locations to converge on the best design option is simply too cumbersome and time consuming. Using AI can be a real gamechanger when it comes to figuring out where and how to use decaps in PDNs. This presentation will showcase a new methodology that uses a target objective that considers both cost and performance. Cadence Optimality Explorer, along with Sigrity X SystemPI, is leveraged to determine the ideal combination of decap values and empty locations to achieve acceptable PDN performance at the lowest possible cost.
11:00 a.m. – 11:30 a.m. Eastern Time
Design for Power Integrity: Decap Selection Strategies for Low Target Impedance
Prof. Francesco de Paulis
The current power distribution network (PDN) design involves voltage rail supplying hundreds of Amps. This leads to a very low target impedances approaching the mΩ range. A very careful design is necessary at both Printed Circuit Board (PCB) and package level for ensuring an effective design with only the necessary decoupling capacitors (decaps). Since the final objective is the voltage ripple noise to be within the limit dictated by the specific voltage rail, the decap selection process based on the evaluation of the voltage noise will be shown to be the best one for achieving a cost-effective solution in terms of number of decaps, layout area, and design cycle. Moreover, the possibility to reach a PDN impedance in the mΩ range requires a detailed knowledge of the parasitics inductance (ESL) and resistance (ESR) associated to the PDN layout and to the component itself. If such parasitcs are not properly modelled, they may lead to high Q-factor PDN impedance resonances that inherently limit the design effectiveness. Therefore, a comprehensive modeling approach should be adopted to evaluate the optimum combined values of capacitance and parasitic inductance and resistance to achieve a smooth resonance-free PDN impedance below the required target limit.
11:30 a.m. – 12:00 p.m. Eastern Time
Simulation vs. Reality: Analyzing What You Will Really Build
Todd Westerhoff
Achieving “right first time” PCB designs remains challenging, even with strict adherence to layout rules. Costly respins often occur due to two fundamental issues: inaccurate manufacturing process simulation and incomplete design verification.
Current design practices frequently fall short in two critical areas.
- Simulations often fail to accurately represent manufacturing realities, such as variations in plating layer thickness, conductivity, and metal roughness between core and prepreg layers.
- Time constraints typically force engineers to verify only selected portions of the design rather than conducting comprehensive testing.
To address these challenges, we propose two solutions:
- Implement more accurate simulation models that reflect real manufacturing conditions rather than idealized scenarios. This means accounting for actual fabrication variables instead of working with simplified assumptions.
- Develop automated, comprehensive post-layout verification processes that can efficiently test all serial channels. This approach replaces traditional methods that limit verification to select channels, ensuring complete design margin verification across the entire board.
These improvements can significantly reduce the gap between simulated and actual performance, minimizing expensive design iterations.
PCB/Interconnect/EMI – Afternoon Sessions, October 22, 2025
1:00 p.m. – 1:30 p.m. Eastern Time
KEYNOTE: From 100G Cable Backplanes to 400G Phys for Scale Up: System Level SI at Scale
Andrew Josephson
This session explores the evolution of high-speed interconnects through the systems engineering lens of relevant industry artifacts in 400G pathfinding efforts. It begins with the transition at 112 Gbps, where designs moved beyond traditional PCB-only layouts into hybrid cable backplanes, marking a key inflection point in signal integrity and interconnect design. Artifact examples include industry conference papers, current and relevant 400G contributions, and measurement test data from precision multi-lane mm-wave test fixtures used in high-speed SerDes validation and test. These tools enable scalable, configurable, and high-fidelity signal integrity validation at extreme data rates. The presentation connects these developments from EM scale RF limitations, interconnect bandwidth challenges, coding schemes tradeoffs to Ai scale compute cluster network topologies. Rather than a generic overview of speed milestones, this talk offers a grounded perspective on how engineering constraints and decisions shape the paths toward ever more efficient many-point network topologies. Attendees will gain insight into the cross-disciplinary effort required to advance interface technologies and how historical context can inform future design strategies. The theme “It takes a village” is reflected in the convergence of signal integrity, test and measurement, RF, and system architecture needed to support next-generation data rates.
1:30 p.m. – 2:00 p.m. Eastern Time
Why 448G/Lane Data Rates Will Need UHDI PCBs
Zachariah Peterson
As the industry starts to shift from 112G to 224G PAM-4 systems, organizations like the Ethernet Alliance, SNIA, OIF, and IEEE are already looking to the next generation with 448G per lane data rates. While signal integrity issues with cabling, connectors, and modules are being addressed quickly, IC substrates and land patterns on the PCB remain a bottleneck to ensuring signal integrity at 224G and 448G.
Based on results in the literature and work done by the author, this presentation shows why UHDI design and manufacturing will be a requirement to support 224G and 448G per lane data rates. The results illustrate how materials influence signal integrity in UHDI builds, and how via/transmission line designs at UHDI feature sizes impact signal propagation in IC substrates and the PCB.
The specific bandwidth and noise margin requirements for 448G will depend on the chosen modulation format. Based on simulation results for via structures and transmission lines at UHDI feature sizes, we can compare the available channel bandwidth with the required bandwidth for PAM-6 or PAM-8 modulation. From the PCB/packaging perspectives, it appears that PAM-8 is an optimal modulation format that balances higher bandwidth against tighter noise margins in M-ary PAM signaling.
2:00 p.m. – 2:30 p.m. Eastern Time
Advanced Testing Solutions: EMC, Radar, and Power Measurements with Maury Amplifiers and Sensors
Giampiero Esposito
Accurate and efficient test solutions are essential to advancing today’s electronic systems, from EMC compliance to radar performance and power characterization. This webinar introduces Maury Microwave’s latest amplifier and sensor technologies designed to improve measurement accuracy, repeatability, and speed across a wide range of applications.
Attendees will learn how Maury’s broadband and pulsed amplifiers enable realistic testing environments for EMC and radar systems, delivering high power with exceptional linearity and reliability. The session will also highlight Maury’s innovative power sensor portfolio, which provides precise measurements over wide dynamic ranges with simplified integration into automated test setups.
Join us at EDI CON Online 2025 to explore advanced test methodologies and discover how Maury’s amplifiers and sensors are shaping the future of EMC, radar, and power measurement.
2:30 p.m. – 3:00 p.m. Eastern Time
Electromagnetic Compatibility Simulations for Air, Sea, and Ground Platforms
Dr. C. J. Reddy
Electromagnetic compatibility (EMC) is a critical part of platform design in the defense industry. Numerical simulation for EMC problems – such as radiation or crosstalk at cable harnesses – can help to identify and analyze potential EMC issues at an early stage and find corrective actions. When designing complex systems, compliance with electromagnetic radiation hazard standards (e.g., ICNIRP 2020) must be ensured. In this talk, we will introduce electromagnetic simulation methods for cable modelling (radiation/irradiation), shielding effectiveness, High Intensity Radiated Fields (HIRF) and Electromagnetic Pulse (EMP). We will also discuss the hazards of electromagnetic radiation to personnel (HERP), ordnance (HERO), and fuel (HERF) and how this can be estimated through numerical simulations with Altair technology.