April 23 Morning Sessions: Radar/Automotive/SATCOM
April 23 Afternoon Sessions: 5G/6G/IoT
October 22: SI/PI/PCB/Interconnect/EMI Sessions
Radar/Automotive/SATCOM – Morning Sessions, April 23, 2025
9:00 a.m. – 9:30 a.m. Eastern Time
KEYNOTE: Overview of Latest Technical Trends in Radar
Dr. Joe Guerci
The past several years has seen a significant uptick in the introduction of new radar techniques and applications in non-traditional areas. On the technical systems front, advances continue in MIMO methods, cognitive fully adaptive radar (CoFAR), and combined radar and comms or as its come to be known integrated sensing and communications (ISAC). Key advances have also been made in enabling RF and embedded computing technologies including advanced transceivers, radar systems-on-a-chip (RSOC), and all “digital radars”. New and rapidly emerging applications include counter UAS (CUAS) radars, human gesture recognition and health monitoring, and autonomous driving and safety systems. This talk will survey the latest trends with an eye towards the key tech enablers and challenges facing each of these areas.
9:30 a.m. – 10:00 a.m. Eastern Time
Introduction to Advanced Substrate Technologies (Thick Film, Direct Bond Copper, and Active Metal Braze) for Power & RF Needs
Chandra Gupta, PhD
Whether the application is a military and commercial radar, commercial wireless/cellular system, complex IoT network, or a sensor solution deployed in a remote or mobile context — modern RF systems present significant performance, power-handling, form-factor, and operating environment challenges. In many of these applications, metallized ceramics offer significant advantages. To name but three:
• Thick Film substrates/circuits are manufactured using a screen-printing process to deposit multiple layers of conductive, resistive, and dielectric materials onto an insulating substrate, typically alumina, aluminum nitride or beryllium oxide. It is cost-effective, reliable, and compatible with surface-mount technology (SMT).
• Direct Bonded Copper (DBC) consists of alumina or aluminum nitride substrate, with copper film bonded to one or both sides through a high-temperature oxidation process. They are especially well suited for power modules, where efficient heat dissipation and high current carrying capacity are needed.
• Active Metal Braze (AMB) involves brazing a copper foil, to a silicon nitride board using a high-temperature vacuum process. AMB substrates have similar electrical and thermal properties to DBC substrates but are particularly suited for applications requiring high reliability, heat dissipation and high ampacity and excellent heat spreading capabilities.
This presentation will expand on these options, with particular emphasis on thermal management, electrical properties, and mechanical considerations.
10:00 a.m. – 10:30 a.m. Eastern Time
Revolutionizing Mobility: From Connectivity to Insights with Innovative Automotive Technologies
Shane O’Mahony
The automotive industry is undergoing a profound transformation, driven by the advent of software-defined vehicle technologies. These innovations are ushering in an era of hyper-personalized, immersive, and connected vehicle cabins, enhancing safety and efficiency in unprecedented ways. At the heart of this revolution are semiconductor innovations, which play a pivotal role in enabling this mobility transformation. Advanced semiconductor technologies facilitate seamless interoperability between various sub-systems, enhance the vehicle’s ability to sense and interpret the analog world, and provide critical insights that drive actionable outcomes. This presentation will explore how these cutting-edge technologies are revolutionizing mobility, from connectivity and cabin experience to electrification and advanced driver-assistance systems (ADAS), paving the way for a smarter, safer, and more efficient automotive future.
10:30 a.m. – 11:00 a.m. Eastern Time
Demystifying Pulse RADAR Power Measurements – Common Challenges and Solutions
Bob Buxton
Pulse, pulse-doppler, and pulse compression RADARs are widely used in many civilian and military applications. The quality of the transmitted pulses is critical for maximization of many RADAR performance parameters. After an introduction describing RADAR types and applications, this webinar will focus on RADAR pulse characteristics and the challenges that pulse degradations can cause in RADAR performance.
The webinar will conclude with details of RADAR pulse characterization using a powerful, yet cost-effective, solution based on peak power sensors. Important power sensor characteristics will be described along with an actual example of pulse characterization that was critical to the ability to improve RADAR range performance and/or detection capability.
11:00 a.m. – 11:30 a.m. Eastern Time
Transparent Antennas for 5G and Beyond
Daniel T Skiba
This presentation explores the advancements in transparent antenna technology for automotive, 5G and beyond, focusing on CHASM’s innovations using carbon nanomaterials. It highlights the advantages of AgeNT materials, which offer high transparency (>96%) and low sheet resistance (~1 Ω/□), enabling efficient, nearly invisible antennas. The presentation covers material characterization, simulation, and manufacturing optimization, demonstrating performance comparable to traditional antennas.
Applications include automotive, 5G networks, Fixed Wireless Access (FWA), and phased array antennas, which enhance signal directionality and beamforming. With 5G expected to cover 65% of the world by 2025, transparent antennas provide an aesthetically and functionally superior alternative for urban and residential deployments. CHASM’s research underscores its role in driving next-generation connectivity solutions through sustainable, high-performance materials.
5G/6G/IoT – Afternoon Sessions, April 23, 2025
12:00 p.m. – 12:30 p.m. Eastern Time
KEYNOTE: Multiphysics Modeling of High-Speed Communication Devices
Andrew Strikwerda
In this session, we will explore the use of the finite element method (FEM) for multiphysics modeling in high-speed communication technologies, such as phased antenna arrays and 5G millimeter-wave filters. The performance of microwave and millimeter-wave antennas and circuits is pivotal for 5G, the internet of things (IoT), and satellite communications. By employing electromagnetic simulation software to assess these devices before physical fabrication and testing, the design process can be streamlined significantly, saving both time and effort throughout the development cycle.
We will introduce an efficient modeling workflow for microwave and millimeter-wave devices and demonstrate how to incorporate additional physical phenomena such as electromagnetic heating. The session will conclude with a comprehensive overview of the advantages of multiphysics couplings that account for heating, mechanical deformations, and other physical effects.
12:30 p.m. – 1:00 p.m. Eastern Time
The Next Wave of Mobile – Innovations Shaped where AI, Mobile and Cloud Meets
Peter Linder
The most advanced mobile markets have entered the next wave of mobile, five years into the 5G deployment cycle. Characteristic of this inflection point is the transition from Non-Stand-Alone to Stand-Alone 5G architectures, enabling new use cases, networks, business models, and capabilities. This mobile shift is part of the market momentum for AI and Cloud, where 5G connectivity plays a key role in connecting mobile/personal devices.
The new use cases come from application and device innovations delivered over public Mobile 5G infrastructure. With a foundation in high-performing programmable networks, we can also support new sectors that previously depended on wired infrastructure or dedicated networks. Fixed Wireless Access, Wireless WAN, Private 5G Networks, Virtual Private Networks, Mission-Critical and Non-Terrestrial Networks are networks that can support new industry sectors.
This talk will cover the next wave of mobile technology, how AI, Cloud, and Mobile fit together, and the innovations we expect to see on top of the 5G platform. It will also cover the role of differentiated connectivity and the business model innovations required to unlock the potential in the broader ecosystem.
1:00 p.m. – 1:30 p.m. Eastern Time
Optimizing 5G Networks: Coverage, Beamforming, and Performance Enhancement
Shashikumar R
The rapid advancements in wireless connectivity are transforming modern communication, enabling ultra-fast data transfer, low-latency communication, and large-scale IoT integration. As industries adopt 5G and prepare for 6G, innovations in smart cities, autonomous systems, and industrial automation continue to evolve. This webinar explores the latest developments in next-generation networks, their market potential, and future roadmaps, offering key insights into their transformative impact.
A major highlight of the session is Altair WinProp technology (a Feko component), which brings simulation technology for 5G applications using various propagation models and across multiple scenarios. With advanced capabilities in radio coverage prediction, interference analysis, and signal behavior assessment, WinProp enables efficient network planning and deployment, ensuring seamless connectivity in complex environments.
The webinar will cover 5G radio channel and coverage analysis, essential for efficient network design and optimization. In addition, it will explore beamforming techniques, which enhance spectral efficiency, improve signal strength, and maximize network performance. Using advanced modeling and simulation tools, attendees will gain valuable insights into optimizing wireless networks for future advancements.
1:30 p.m. – 2:00 p.m. Eastern Time
5G-Advanced Moving Towards 6G
Viet Nguyen
The transition from 5G to 6G marks a pivotal moment in the evolution of wireless technology, laying the foundation for unprecedented connectivity and innovation. Viet Nguyen, president of 5G Americas will explore how 5G-Advanced serves as a critical bridge towards the 6G era. As an enhancement to the current 5G standard, 5G-Advanced introduces advanced capabilities such as improved spectrum efficiency, AI-driven network optimization, and support for emerging use cases like extended reality (XR), autonomous systems, and digital twins. These developments not only enhance network performance but also address growing demands for sustainability, resilience, and inclusion.
The presentation will delve into the technologies driving this evolution, including advancements in massive MIMO, edge computing, and non-terrestrial networks, while highlighting how these innovations set the stage for the future 6G ecosystem. The collaborative efforts required among industry stakeholders, academia, and governments to shape global standards and ensure seamless integration will also be covered. By providing a forward-looking perspective on the opportunities and challenges of 5G-Advanced, this talk will illuminate how today’s advancements are paving the way for the transformative possibilities of 6G connectivity.
2:00 p.m. – 2:30 p.m. Eastern Time
Simulating and Emulating the Future: 6G RF Propagation Digital Twin
Usman Virk
The rapid advancement of wireless technologies requires innovative design tools capable of accurately simulating complex RF propagation environments. Join Keysight’s Usman Virk and learn how to accelerate the development of advanced 5G and 6G technologies with a comprehensive physical AI testing environment for next-generation wireless systems.
Keysight’s Channel Studio RaySim, RF raytracing Digital Twin Solution, enables fast and precise creation of site-specific RF propagation scenarios for digital twin simulations and real-world device testing through emulation. Combined with Keysight’s base station (BS), user equipment (UE), and channel emulators, the RaySim and integrated digital twin simulations inform network emulation, providing real-world insights into network performance. This approach helps identify network limitations and allows the deployment of 6G technologies to address those challenges effectively.
2:30 p.m. – 3:00 p.m. Eastern Time
5G and 6G IoT Outlook
Joe Madden
A view of how IoT will grow along with AI and automation in various enterprise markets…with details on the requirements for RF component suppliers.