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EDI CON Online Successfully Completes 4th Annual Event

EDI CON Online 2022, an interactive event that was held every Wednesday in October 2022, provided workshops, technical sessions and keynote talks for engineers working on RF, microwave, EMC/EMI, signal integrity and power integrity designs. The event, which held live online sessions that are now available on demand, displayed impressive results for its third year with more than 1250+ unique live attendees and 23,800+ total individual registrations. As compared to last year’s event, the number of live attendees increased by more than 10 percent.

Participants noted their overall satisfaction with the event. 98 percent of attendees surveyed said they would attend another EDI CON Online conference, 96 percent would recommend the event to a friend or colleague, and a combined 98 percent of attendees rated the sessions as excellent or good.

An attendee who shared feedback stated, “The past few years I have found sessions very informative. Even though not all are applicable to me–the ones that are, were worth the time. I have even passed them along to colleagues.” A couple of other comments were “Informative and helpful presentations” and “Great platform!”

Over a span of four weeks, EDI CON Online 2022 consisted of 44 presentations with 51 speakers, four plenary keynote talks, 18 technical sessions and 18 sponsored workshops. Platinum sponsors: Samtec, Dassault Systems, Amphenol and Altair delivered engaging featured workshop presentations. The technical sessions and workshops offered opportunities for attendees to participate by asking questions during live Q&A sessions.

EDI CON Online event organizers have already announced the 2023 dates. The online conference will take place every Wednesday in October 2023, with a plan to present sessions over four consecutive weeks (October 4, 11, 18 and 25) which will be organized into the following tracks: Signal Integrity/Power Integrity; 5G/Wi-Fi/IoT; PCB/Interconnect/EMC-EMI; and Radar/Automotive/SATCOM.

Platinum, workshop and track sponsorships are now available for 2023. Interested sponsors can contact their Microwave Journal and Signal Integrity Journal sales representatives for more information or visit www.edicononline.com. You can still register and watch all 2022 sessions on demand. Registration for the 2023 event will be open in the summer of 2023.

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EDI CON Online Registration Opens Giving Free Access to Training

Free registration to 31 sessions delivered over 3 days gives engineers working in RF, microwave, and high-speed digital applications access to training sessions without leaving the office.

 

August 8, 2019 (Norwood, Mass.) – EDI CON Online, a new interactive event being held online September 10-12, 2019, has opened registration for its three days of tracks: 5G/IoT (September 10), Radar/Antenna (September 11), and Signal Integrity/Power Integrity (September 12), with EMC/EMI topics spread throughout the tracks. The interactive technical sessions will occur at no cost to attendees, and attendees are also eligible to earn IEEE CEU/PDH credits for attending.

The thirty-one sessions over three days include keynotes, technical sessions, and sponsored workshops. Attendees select the sessions for the online event in a single sign-on registration portal and can participate in as many sessions as they wish live (with question and answer sessions) or watch later on demand. Sessions are produced on a multimedia platform, including video, traditional webinar, and screen sharing formats.

EDI CON Online is pleased to announce that Rohde & Schwarz, Mini-Circuits, and Samtec will be the Platinum Sponsors of the event and will be producing each day’s opening keynote, respectively. Here is a list of the speakers currently scheduled for technical sessions at EDI CON Online. For the complete program, including workshops and keynotes, see the online program https://www.edicononline.com/program-schedule/.

September 10, 2019: 5G/IoT (including EMC/EMI)

  • Design of a Fully Integrated, Surface Mount 3.5 GHz Doherty GaN PA for 5G Applications, Robert Smith, Plextek RFI
  • EMC Success Strategies for the Internet of Things, Mike Violette, Washington Laboratories & American Certification Body
  • 5G Phased Array Antenna Design, Anil Pandey, Keysight Technologies
  • mmWave Will Be the Critical 5G Link, Joe Madden, Mobile Experts Inc.
  • 5G and the Future of Low Latency Applications, Caroline Y. Chan, Intel Corporation

September 11, 2019: Radar/Antennas (including EMC/EMI)

  • A Three-Step Process for Radiated Emissions Troubleshooting Success, Ken Wyatt, Wyatt Technical Services, Inc.
  • Near-Field Antenna for RFID Tag Inspection, Scott Best, SiberSci, LLC
  • MIMO Radar for Vehicles, Eli Brookner
  • Metamaterials for Electronic Scanning, Wideband Antennas and Stealth/Cloaking, Eli Brookner
  • Latest Trends in Active Electronically Scanned Antennas (AESAs), Joseph R. Guerci, President/CEO of Information Systems Laboratories Inc.

September 12, 2019: Day 3: SI/PI

  • Characterizing the VRM, Steve Sandler, Picotest
  • Best Design Practices to Eliminate Ground Bounce in Your Next Product, Eric Bogatin, University of Colorado, Signal Integrity Journal, and Teledyne LeCroy
  • Test Fixture De-embedding for PCB Characterization and Material Extraction, James L. Drewniak, Missouri S&T
  • High-Speed Interconnect Design and Correlation at 112 Gbps PAM: How does this affect me? Scott McMorrow, Samtec
  • DDR/LPDDR Board Design for Signal and Power Integrity, Shalom-Shlomi Zigdon, The College for Board Design and PCB Engineering at Israel

 

Attendees who wish to register for free can do so here: https://www.edicononline.com/register/.

 

About EDI CON
EDI CON uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today’s communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. At EDI CON CHINA, the exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. EDI CON Online brings this same type of learning directly to engineers’ desktops. More information at www.edicononline.com.

About the Organizers
EDI CON is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (May 12-13, 2020  in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

 

EVENT CONTACT:
Carl Sheffres, Publisher & EDI CON Sales Director
+1-781-619-1949
csheffres@mwjournal.com

 

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EDI CON Online Will Reach Global Audience

New online, interactive event held September 10-12 will give engineers the opportunity to attend free training sessions without leaving the office.

April 23, 2019 (Norwood, Mass.) – The Electronic Design Innovation Conference and Exhibition (EDI CON) announced that this year, in conjunction with Microwave Journal (MWJ) and Signal Integrity Journal (SIJ), it will host an online, interactive event for high frequency and high speed design engineers on September 10-12, 2019.  The interactive technical sessions will occur at no cost to attendees, and sponsors will have the opportunity to present workshops and keynote sessions as part of the daily schedule.

The sessions on September 10th will focus on 5G and IoT, September 11th on radar and antennas, and September 12th on signal integrity, power integrity, and EMC/EMI. Attendees select the sessions for the online event in a single sign-on registration portal and can participate in the sessions live (with question and answer sessions) or watch later on demand. Sessions are produced on a multimedia platform, including video, traditional webinar, and screen sharing formats.

“By polling our audiences, we confirmed that many engineers are finding it challenging to get out of the office to get the training they need,” said Carl Sheffres, Publisher Microwave Journal and Signal Integrity Journal, “So, with the help of our sponsors, we will bring quality, relevant, real-time training right to the engineers with EDI CON Online.”

Attendees can select from five technical sessions in each day’s track, as well as a keynote presentation and up to six topical workshops held each day. The track topics were selected in direct response to reader requests. Editors from MWJ and SIJ are recruiting speakers for the conference, paying particular attention to the specific topics identified through a recent poll of readers.

Sponsors can get involved at one of three levels: Platinum Sponsor, Track Sponsor, or Workshop Sponsor, and can contact their MWJ/SIJ sales representatives for more information, or go to www.edicononline.com.

 

About EDI CON
EDI CON uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today’s communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. At EDI CON CHINA, the exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. EDI CON Online brings this same type of learning directly to engineers’ desktops. More information at www.edicononline.com.

About the Organizers
EDI CON is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 24-26, 2020  in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

 

EVENT CONTACT:
Carl Sheffres, Publisher & EDI CON Sales Director
+1-781-619-1949
csheffres@mwjournal.com