Key Features Affecting Circuit Board Stack-ups and Minimum Design Rules

Julie will discuss trade-off analysis performed by the printed circuit board fabricator when creating a complex stack-up. You will learn how design features required by the customer, such as min pitch BGA, material Dk/Df, drill structures, number of layers, layer copper thicknesses, and controlled impedances interplay in the final stack-up calculations to determine whether the stack-up is easy, or extremely difficult, to fabricate within its technology classification. Examples of competing inputs, such as thick boards with small drills resulting in high aspect ratios, and how small-pitch parts on heavy Cu layers have etch issues will be included.